doi: 10.23255/THESTEAM.2024.1.2.157 Citation BibTeX RIS Mendeley

Understanding and Application of Three-Dimensional Spatial Shapes through 4DFrame, Arduino, and Tinkercad: Integrated Educational Strategies

4D프레임, 아두이노, 팅커캐드를 활용한 3차원 입체도형에 대한 이해 및 연계 교육 활용 방안

• Jung Sunggyu (일산한빛4D프레임센터)
• Lee Si-young (일산한빛4D프레임센터)

The growing importance and interest in software education have led to an expansion of software-based technical programs, such as coding education and 3D printing. This study proposes an educational model designed to effectively cultivate the essential software competencies deemed critical in the era of the Fourth Industrial Revolution. To this end, three tools—Tinkercad, Arduino, and 4Dframe—were employed to develop an “Automatic Recycling Bin Utilizing an Ultrasonic Sensor.” This initiative not only provides hands-on experience with 3D printing technology and IT-related software but also enhances insight into cutting-edge technologies. Moreover, the creative design and fabrication process integral to the project is expected to foster improved problem-solving skills, creativity, and critical thinking.